Applied Microengineering Ltd (AML) is an independent private company established in 1992...
We manufacture unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound BONDCENTRE facility situated on UK’s premiere science park in Harwell, Oxfordshire.
Our unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support.
We also have a comprehensive BONDCENTRE which provides services from the development of bonding processes to a commercial bonding service – one off to low volume. Associated services include; powder blasting, screen printing & metrology, a ‘One Stop’ wafer bonding service. The BONDCENTRE offers the perfect venue for those involved in bonded substrates, device fabrication, 3D integration and wafer level packaging.
AML was the first company formed specifically to exploit MEMS technology or Micro-Nano Technology (MNT) as it is now known. After a number of years designing and producing MEMS devices such as Micro sensors and Microfuidic devices, AML changed direction and now focuses solely on wafer bonding equipment & services.
Find out more about our products & services ring us on +44 (0)1235 833934
AML manufactures unique in-situ aligned wafer bonding machines and provides services based around waferbonding in its state-of-the-art multi-million pound Bondcentre facility situated on UK’s premiere science park in Harwell, Oxfordshire.
For more information on our products & services ring us on +44 (0)1235 833934
if you are planning to visit us there are a number of places in the area which are able to provide accommodation. For your convenience we have listed some which you can see on our
